PVD Systems

Physical Vapor Deposition or PVD is a high purity technique for the vacuum deposition of thin-film and nanoparticle coatings. Physical techniques such as sputtering and thermal evaporation (organic or inorganic) are used to generate a vapor of material. Material vapor generated by the source is carried to the substrate at low gas pressure. Upon contact with the substrate, the vapor condenses to form a thin-film. In the case of nanoparticles,  metal vapor generated by sputtering condenses into nanoparticles in the gas phase before reaching the substrate. Nikalyte PVD systems can be used for thin-films, nanoparticles, multilayer stacks, composites etc. to grow unique functional materials.

Compact PVD systems

  • Low cost, compact, flexible PVD system 
  • Cycle time under 45 minutes
  • Models: 375 (5 sources, 4″ subs) , 300 (4 sources, 2″ subs)
  • Front-loading chamber with CF ports, for up to 5 sources
  • Upward or downward facing source configuration
  • Integrated electronics, pumps, with automation software

UHV PVD systems

  • UHV PVD system with load-lock and bakeout option
  • Compatible with Nikalyte  and third-party sources
  • Confocal CF ports for up to 5 sources
  • Substrate stage with rotation, heating, RF/DC biasing
  • Fully automated, recipe-driven software
  • Create high-purity nanoparticlethin film composites

Modular PVD systems

  • Front-loading, spacious chamber for easy access
  • Upward or downward facing source configuration
  • Sample stage with rotation, heating, and RF/DC biasing
  • Supports flexible substrates, powder coating, reel-to-reel
  • Fully automated, recipe-driven software
  • Compatible with third-party sources

Benchtop Nanoparticle system

  • Generate metallic/compound nanoparticles (oxides, nitrides)
  • Deposit hydrocarbon-free, non-agglomerated nanoparticles
  • Wide material selection: Au, Ni, Ir, Pt, and more
  • Real-time deposition control via QCM
  • Typical cycle time: 30 minutes
  • Room temperature deposition for delicate substrates 
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