Triple Target Sputter Source: Tri Stellar
The Triple target magnetron sputter source enables co-evaporation and multilayer deposition of up to three different materials from one compact UHV source.
The triple target sputter source is a versatile and compact cluster sputter tool designed for co-sputtering of up to three different materials using a single magnetron source. It is ideal for applications involving alloy or multilayer thin film deposition, particularly in environments with limited space. Each target has independent power control, allowing for operation with DC, RF, pulsed DC, or HiPIMS power supplies. This instrument enables users to co-sputter multiple materials to create alloys or switch materials to form multilayers, all without the need to break vacuum.
The Tri Stellar sputter source is constructed on a single CF100 flange so can be easily fitted to an existing PVD systems or incorporated into our custom-built NEXUS and NL-FLEX vacuum systems. Check out the Stellar range of single target UHV sputter magnetrons.
Key Features
- Compact Co-sputtering source
- UHV compatible
- Bakeable up to 250°C (no need to remove magnets)
- Three 1- inch targets
- Independent power control
- Choice between manual and pneumatically controlled shutter
- Customizable in vacuum length
- Compatible with DC, RF Pulsed DC and HIPMS power supplies
Specifications
| Head Diameter | 97mm (with a +/-0.1mm tolerance) |
| In Vacuum Length | 300mm as standard (Configurable) |
| Target Operation | Independent or Simultaneous |
| Target Size | 3 * 1 Inch (25mm) |
| Target thickness | Up to 3mm (nonmagnetic target), up to 0.4mm (magnetic target) |
| Deposition Rate | Typically, 5 Å/s per target, depending upon material |
| Source Output | 3*75W |
| Target utilisation | Up to 25% |
| Power Supply | DC, RF, Pulsed DC (unipolar or bipolar) and HiPIMS |
| Shutter | Manual or Automated |
| UHV | Bakeable up to 250°C |
| Gas Distribution | Gas injection hood |
| Mounting Flange | CF100 |
| Cooling | Min Water flow 1l/min |