PVD of Ruthenium and Cobalt for Next-Gen Metallization
Want to read offline? [Download PDF] Copper has carried the signals inside microchips for many decades. As logic scaling pushes towards the 18A and 14A nodes, the narrowest interconnect lines are approaching the 10 nm scale, and copper dual-damascene metallisation is becoming harder to extend [1]. Ruthenium (Ru) and cobalt (Co) have emerged as two
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