Nano-Silver Bonding for High-Power Electronics Packaging
Industry: Electronics / Semiconductor Packaging / Advanced Materials Challenge: Loughborough University, led by Prof. Changqing Liu, sought to address the growing demand for advanced interconnect materials in electronics packaging. Specifically, there was a need for low-temperature, fast bonding solutions that could withstand high temperatures and high-power density environments, such as those used in wide bandgap […]
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